Cantilever Probes

In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.

Probe Diameter

50 ~ 500 um

Probe Length

38 ~ 102 mm

Tip Shape

Sharp , Flat Tip

Tip Diameter

6 ~ 10 um

More information

Cantilever Probe Specific characteristics

In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.

Probe needles are used as the key component of a probe card to contact the pads of the chips on the wafer for electrical testing.

 

A. Mechanical Grinding Probe:  
Probe specifications
Probe Material P7, H3C, Pd Alloy
Probe Diameter 50 ~ 250 um
Probe Length 50 ~ 102 mm
Tip Shape Flat Tip
Tip Diameter 6 ~ 10 um
Surface Semi Matte

 
 
B. Chemical-etching Probe:  
Probe specifications
Probe Material Ni-W , Ni-ReW
Probe Diameter 60 ~ 500 um
Probe Length 38 ~ 102 mm (1.5”/2.0”/2.5”/3.0”/3.5”/4.0”)
Tip Shape Sharp , Flat Tip
Surface Semi Matte , Polished

 
Insulation Coating:
specifications
Probe Material Ni-W, Ni-ReW, P7
Coating Thickness 2 ~ 5 um
Coating Material Polyimide