Vertical Probes

In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.

Probe Material

P7, H3C, Pd Alloy

Probe Diameter

1.5/2.0/2.5/3.0/3.5 mil

More information

Vertical Probe Specific characteristics

In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.

Probe needles are used as the key component of a probe card to contact the pads of the chips on the wafer for electrical testing.

 

A. Cobra Probe:  
Probe specifications
Probe Material P7, H3C, Pd Alloy
Probe Diameter 1.5/2.0/2.5/3.0/3.5 mil
Tip Shape Flat Tip
Head Shape Headed/Headless
Others Customized