Trouble shooting and optimum design
During LED chip sorting and semiconductor IC die bonding assembly processes, the rubber tips are of great significance and necessary to be utilized for vacuuming dies up, releasing from tapes and transfer to further process. G.C Micro is able to provide variant kinds of rubber tips with variant materials and different specifications as resulted from the change in die dimension and appearance. Noteworthily, we have successfully developed rubber tips with ID small than 0.05 mm and is able to massively produce the one with ID=0.03 mm for mini-LED applications.
Since 2015, G.C Micro had began to step into semiconductor IC industries, aiming to provide more kinds of rubber tips, bakelite collets (ID=0.06 mm) and metal vacuum tips for high-temperature and wafer level chip scale package processes.Concurrently, we also issued an IP in Taiwan (Paten no. M506970) to solve die sticking problem during assembly process.