Well-oriented on-time delivery

During LED chip sorting and semiconductor IC die bonding assembly processes, the ejecting needles are necessary to be utilized for pushing dies up, releasing from tapes and transfer to further process by vacuum tips.

G.C Micro is able to provide variant kinds of ejecting needles with variant materials and different specifications as resulted from the change in die dimension and aspect ratio and special concern of without damaging to the dies. We are specialized in product development and quality control to ensure fulfilling customer demands.