High thermal conductive TCG-G paste
The paste of TCG-G product has extremely high thermal conductivity (>14 W/mK) but low viscosity that is very suitable for device packaging.
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Product Information
TCG-G paste
•The paste of TCG-G product is developed with its superior specifications of:
- Thermal curing type
- High thermal conductivity >14 W/mK
- High temperature stability
- Good adhesion
- Adjustable Coefficients of Young’s Modulus and Thermal Expansion
- Low viscosity
• Applications:
The TCG-G paste, is a thermally conductive chemical compound, which is used as an interface between heat sinks and heat sources. The main role is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.
- Electronic components appliance - 5G, HPC, CPU, LED, Switching Power Supply, Heat Sink, etc.
- Eliminate air gaps or spaces from the interface area between any heat source and heat sink.
• Specific characteristics:
| Parameters | FTG014 series |
| Thermal Conductivity | 14 W/mK |
| Color | White/Gray |
| Density | 2.8 g/cm³ |
| Viscosity | 65000~85000 mPas (30 °C) |
| Curing condition | 140 °C，60 mins |
| Working Temperature | -40~+180 °C |
| Volume Resistance | >1012 Ohm-m |
| Tg (°C) | 30 – 50 – 160 °C |
| CTE | 68 – 45 – 14 ppm |
| Young’s Modulus | 20MPa – 177MPa – 2.4 Gpa |