Outstanding innovation

TCM-A

The substrates of Thermal Cermet Materials (TCM) with high thermal conductivity initiate the best thermal dissipation solution for the dies on package in the omni-directional applications.

TCG-G paste

The TCG-G paste, is a thermally conductive chemical compound, which is used as an interface between heat sinks and heat sources. The main role is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.