| Camera module |
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- Accurate alignment of the socket center to the camera module optical center.
Suitable for all kinds of module designs.
- Well experienced over 3,000 cases.
- Applicable of seamless implantation in-line production and off-line quality check.
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| Edge-contact module |
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- Fitting to the specific test device, the PA is contacted from edge by pin module base while the optical center of the camera module device is still aligned from top.
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| LCD display panel |
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- Applicable to all kinds of LCD display size and structure.
- Compact size and special custom design.
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| Image sensor device |
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- Suitable for all kinds of image sensor package designs.
- Accurate alignment of the socket center to the optical center of the image sensor package.
- Applicable of seamless implantation in-line production and off-line quality check with flexible lead structures such as discrete, clamshell or cover-open types.
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| LED, EELD, VCSEL chip on submounts |
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- Easy to loading and unloading CoS package devices.
- Special probe pin design to contact metal pads but without damage.
- Great thermal dissipation design and device temperature displaying.
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| EELD TO package |
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- LD TO package (pitch: 1.43/2.0/2.54/5.08 mm)
- Special metal reed design to contact electrode pins without causing scratch damage.
- Lifetime: >10K cycles
- High current (> 5A) operation
- Available to array module for reliability aging test.
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| Evaluation test board with sockets |
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- High current/voltage design
- Low signal design (optoelectronic image sensor)
- High frequency /high speed design
- Compact and high integration design (multi-layers, BGA ,etc.)
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