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ABOUT US

G.C Micro Technology Co., Ltd. was established in Taoyuan City, Taiwan in 2009. G.C Micro is a professional manufacturer of contact probes, rubber tips/bakelite collets and consuming parts such as ejecting needles, EFO, die shear and wire pull tools, metal crucibles for semiconductor IC assembly and LED chip manufacturing/package industries. We are also specializing in being the representatives of worldwide high-tech companies for product promotion and selling into markets, which include optical Diffusers Lens and DOE for ToF 3D imaging applications, high thermal conductivity TCM/TIM materials for better thermal dissipation solution, and sockets for device electrical testings.

Our vision

Being the pioneer of the consuming and raw materials provider in LED and semiconductor IC assembly industries and 3D imaging applications.

Serving to the international famous companies worldwide, the G.C Micro services, which include Pd/Ag/Cu and BeCu alloy contact probes, plastic and metal ejecting needles and modules, rubber tips, bakelite collets and other metal parts, and diffuser lens for ToF 3D imaging applications are of great manufacturing stability and excellent quality. Our insistence is guided from customers’ demand and to put much R&D efforts with an aim of providing good solutions for all customers. To the present, we have successfully developed significant products into mass production for customers’ urgent demands, such as rubber tips with ID < 0.05 mm for mini-LED chip sorting, etc.

Collaboration with customers for a better future, G.C Micro focuses on strengthening our production capability to increasing competitiveness.

For an efficient way to provide local customer services, G.C Micro so far has branched two sales/FAE offices in China Suzhou and Xiamen cities. We will continue putting unmitigated efforts to our profound R&D strength in developing consuming materials for LED and semiconductor IC testing/assembly industries.

G.C Micro history

2026

    • Cantilever probes(alloy material) in mass production (Capacity : >60K/month)
    • Perimeter Wall-type Vacuum Collets introduced into mass production
    • Patent M682127 (Utility Model)

2025

    • Cantilever probes(rhenium-tungsten material) in mass production (Capacity : >150K/month)
    • Developed large-size dissimilar-material Vacuum Collets for CoWoS bare-die packaging
    • Developed ultra-low-temperature (-90℃) Vacuum Collets
    • Expanded sales footprint into Southeast Asian markets
    • Patent M674460 (Utility Model)
    • Patent M677059 (Utility Model)

2024

    • Developed Vacuum Collets for semiconductor IC packaging & test (FT) stations; successfully adopted by multiple customers
    • Patent M667294 (Utility Model)
    • Developed multi-hole (porous) Vacuum Collets

2022

    • Implemented ESG initiatives

2021

    • New factory completed (4,000 m2)

2017 ~ 2020

    • Successfully developed and mass-produced ID=0.03 mm BAC Vacuum Collets
    • Capacity expansion for LED alloy bent-pin probes (250K/month)
    • Capacity expansion for Vacuum Collets(250K/month)

2016

    • Established Xiamen office

2014

    • Implemented ISO-9001 and obtained certification

2012

    • Established Suzhou office

2009

    • Company founded
    • Established probe and rubber-nozzle production lines

Our policies