TCM substrates
TCM substrate is formed by a thin ceramic compound layer with metal core plate and processed by our self-developed coating and electrode-plating technologies to provide a good thermal dissipation solution to customers.
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Product information
I. TCM-A series:
- High thermal conductivity
- Suitable for high power operation package devices that require superior thermal dissipation.
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TCM-A substrate superiority:
- Extreme thermal conductivity (k>200 W/mK)
- Total substrate thickness can be thinner to <0.3 mm
- Easy layout to any package form factor size, reducing cost in product developing phase
- High flexibility, suitable to the processes of die/wire bonding and molding
- High throughput in package singulation dicing process and low blade wearing
- Reliability test qualified