G.C Micro has been collaborating with major domestic and international optoelectronic semiconductor chip manufacturers since 2010 to supply silicone rubber collets for the chip sorting and bonding processes of optoelectronic semiconductor chips, such as LEDs and DFB/EELDs. Over the past decade, G.C Micro has also actively partnered with the leading semiconductor IC assembly and testing companies, playing a pivotal role in supplying silicone rubber collets for both front-end and back-end manufacturing stages.  

Through recent development efforts, G.C Micro successfully introduced “Perimeter Wall-type Vacuum Collets”— designed for the pick&place processes of IC chips featuring solder bumps or copper pillars in WLCSP advanced semiconductor packaging process — to top-tier international manufacturers; the monthly production capacity for this specific product line now exceeds 5,000 units.

To meet diverse customer specifications and ensure rapid delivery, G.C Micro has established a responsive mechanism and design rules, enabling the fast delivery of engineering samples within two weeks to facilitate smooth product trial runs. Mass production requirement of the perimeter wall-type vacuum collets in various specs can also be fulfilled within four weeks.

G.C Micro’s perimeter wall-type vacuum collets feature advanced technical specifications, including a wall width as narrow as 50 µm and a minimal outer dimension of 300 x 300 µm, while maintaining high consistency and product stability. We aim to serve as a key partner to the semiconductor IC assembly and testing industries, providing a stable supply of high-quality, cost-effective vacuum collets across various types.