As well know, G.C Micro has established a mature, 15-year track record in the manufacturing and sales of bent- and straight-type contact probes used for the optical and electrical characterization of optoelectronic semiconductor chips, such as LEDs and DFB/EELDs. During the past several years, G.C Micro relying its own R&D technology has successfully developed the cantilever probes for chip probing in semiconductor wafer level of logic ICs, CMOS image sensors, and driver Ics, etc. EVT/DVT phases of sample delivery began in 2025, followed by the qualifications from major domestic and international probe card manufacturers and the subsequent launch of mass production in 2026. Current monthly production capacity exceeds 100,000 pins, with active capacity expansion underway since the third quarter of 2026 to meet customer mass-production requirement. 

The cantilever probes are available in a wide range of materials, including Tungsten (W), Rhenium-Tungsten (ReW), six-element alloys (Au10%/Ag/Pt/Pd/Cu/Zn), Palladium-Silver-Copper alloys (Pd>40%/Ag/Cu), Platinum-Nickel alloys (PtNi), Gold-Silver alloys (Au70%Ag), and Beryllium Copper (BeCu), etc. G.C Micro employs unique manufacturing technologies to enable mass production across the aforesaid diverse probe materials. The available technical specification covers wire diameter of 2.7/3/3.5/4/4.5/5/6/7/8/10/12 mil, taper length of 40 ~250 mil and most significantly, taping ange of smaller than 1 degree is achieved, as well with superior straightness.

In the field of semiconductor industries, G.C Micro aims to serve as a key partner to cantilever probe card manufacturers, providing a stable supply of high-quality, cost-effective cantilever probes across various specifications.