G.C Micro has independently developed a series of soft sponge nozzles, combined with special foam materials and rubber bases, which are used in the pick-and-place operations of IC packages with uneven surfaces in the semiconductor IC packaging and testing field. Cotton material has a high modulus of elasticity and is not easy to deform.

• The foam and rubber materials comply with SGS specifications, and have ESD static dissipation capability, suitable for packaging and testing environments.
• The shape of the soft sponge nozzle can be developed according to customer needs.