The process of semiconductor IC assembling and testing has given rise to various types of silicone rubber vacuum collets resulted from variant manufacturing conditions and technical specifications. During the thin-film IC chip bonding process, the requested specified specification of vacuum collets must include good surface flatness, uniform vacuum force distribution, and high bonding force, high temperature operation to prevent chip cracking, uneven surface or other stress that may result in damage.

To address these requirements, G.C Micro has developed a set of design rule and dedicated production lines, enabling to meet client specifications for various chip sizes while also shortening lead times.