Cantilever Probes
In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.
Probe Diameter
50 ~ 500 um
Probe Length
38 ~ 102 mm
Tip Shape
Sharp , Flat Tip
Tip Diameter
6 ~ 10 um
More information
Cantilever Probe Specific characteristics
In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.
Probe needles are used as the key component of a probe card to contact the pads of the chips on the wafer for electrical testing.
A. Mechanical Grinding Probe:

Probe specifications | |
Probe Material | P7, H3C, Pd Alloy |
Probe Diameter | 50 ~ 250 um |
Probe Length | 50 ~ 102 mm |
Tip Shape | Flat Tip |
Tip Diameter | 6 ~ 10 um |
Surface | Semi Matte |
B. Chemical-etching Probe:

Probe specifications | |
Probe Material | Ni-W , Ni-ReW |
Probe Diameter | 60 ~ 500 um |
Probe Length | 38 ~ 102 mm (1.5”/2.0”/2.5”/3.0”/3.5”/4.0”) |
Tip Shape | Sharp , Flat Tip |
Surface | Semi Matte , Polished |
Insulation Coating:

specifications | |
Probe Material | Ni-W, Ni-ReW, P7 |
Coating Thickness | 2 ~ 5 um |
Coating Material | Polyimide |