Vertical Probes
In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.
Probe Material
P7, H3C, Pd Alloy
Probe Diameter
1.5/2.0/2.5/3.0/3.5 mil
More information
Vertical Probe Specific characteristics
In semiconductor IC assembly industry, it’s ought to do chip probing/testing in wafer level prior to the singulation process of wafer to die. Probe card that formed by several types of probe needles is undoubted to perform this function.
Probe needles are used as the key component of a probe card to contact the pads of the chips on the wafer for electrical testing.
A. Cobra Probe:

Probe specifications | |
Probe Material | P7, H3C, Pd Alloy |
Probe Diameter | 1.5/2.0/2.5/3.0/3.5 mil |
Tip Shape | Flat Tip |
Head Shape | Headed/Headless |
Others | Customized |