The process of semiconductor IC assembling and testing has given rise to various types of silicone rubber vacuum collets resulted from variant manufacturing conditions and technical specifications. During the thin-film IC chip bonding process, the requested specified specification of vacuum collets must include good surface flatness, uniform vacuum force distribution, and high bonding force, high temperature operation to prevent chip cracking, uneven surface or other stress that may result in damage.

In the field of semiconductor industries, G.C Micro aims to serve as a key partner to cantilever probe card manufacturers, providing a stable supply of high-quality, cost-effective cantilever probes across various specifications.

G.C Micro’s perimeter wall-type vacuum collets feature advanced technical specifications, including a wall width as narrow as 50 µm and a minimal outer dimension of 300 x 300 µm, while maintaining high consistency and product stability. We aim to serve as a key partner to the semiconductor IC assembly and testing industries, providing a stable supply of high-quality, cost-effective vacuum collets across various types.

G.C Micro has independently developed a series of soft sponge nozzles, combined with special foam materials and rubber bases, which are used in the pick-and-place operations of IC packages with uneven surfaces in the semiconductor IC packaging and testing field. Cotton material has a high modulus of elasticity and is not easy to deform.

Compared to conventional LEDs, mini-LEDs have advantages of wide color gamut and high contrast. And, it possess low production cost and high operation reliability when compared to OLED technology.